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EDA Architect Skill

eda-architect

Electronics project architecture and constraint definition. Guides users through defining project requirements, power systems, interfaces, and physical constraints.

SKILL.md

Full skill instructions

EDA Architect Skill

Define the architecture and constraints for electronics projects.

Auto-Activation Triggers

This skill activates when:

  • User asks to "design a board", "create a project", "start a new PCB"
  • User asks "what do I need for..." an electronics project
  • Project has no docs/​project-spec.md or docs/​design-constraints.json
  • User mentions requirements gathering or project planning

Context Requirements

Requires: Nothing (this is the first step)

Produces:

  • docs/​project-spec.md - Human-readable specification
  • docs/​design-constraints.json - Machine-readable constraints

Workflow

1. Understand the Project Goal

Ask the user about:

  • What is this device/​board intended to do?
  • Target use case (prototype, production, hobby)?
  • Any existing designs to reference?

2. Define Power Architecture

Determine:

  • Input power source (USB, battery, mains, PoE, solar)
  • Voltage rails needed (3.3V, 5V, 12V, etc.)
  • Power topology per rail: LDO vs buck converter
    • See reference/​POWER-TOPOLOGY-DECISION.md for decision tree
  • Estimated power budget
  • Battery life requirements if applicable

2.5 Thermal Budget

Estimate early:

  • Total power dissipation (sum of all consumers)
  • Hot components (any >0.5W needs attention)
  • Cooling strategy: natural, forced, heatsink
  • See reference/​THERMAL-BUDGET.md for estimation guide

3. Processing Requirements

Establish:

  • MCU/​processor needs (or if needed at all)
  • Processing requirements (speed, peripherals)
  • Memory requirements (Flash, RAM)
  • Preferred families (STM32, ESP32, RP2040, etc.)

4. Connectivity & Interfaces

Document:

  • Wireless: WiFi, Bluetooth, LoRa, Zigbee, cellular
  • Wired: Ethernet, USB, CAN, RS485, RS232
  • User interfaces: buttons, LEDs, displays
  • Debug/​programming interfaces

4.5 Stackup Decision

Determine layer count based on complexity:

  • 2-layer: Simple, LDO only, low-speed (I2C/​SPI)
  • 4-layer: MCU with switching regulator, USB, Ethernet, WiFi
  • 6-layer: High-speed (>100MHz), DDR, dense routing
  • See reference/​LAYER-COUNT-DECISION.md for decision tree

5. Sensors & I/​O

List:

  • Required sensors
  • Analog inputs/​outputs
  • Digital I/​O requirements
  • Any specialized interfaces (motor control, etc.)

6. Physical Constraints

Define:

  • Target board dimensions
  • Enclosure requirements
  • Mounting hole positions
  • Connector placement constraints
  • Height restrictions

7. Environmental

Note:

  • Operating temperature range
  • Indoor/​outdoor use
  • IP rating if applicable

8. Manufacturing Targets

Capture:

  • Target quantity
  • Assembly method (hand, reflow, turnkey)
  • Layer count preference
  • Budget constraints

8.5 DFM Early Constraints

Capture manufacturer capabilities:

  • Preferred manufacturer (JLCPCB, PCBWay, OSHPark)
  • Assembly method constraints
  • Fine-pitch components (affects hand soldering)
  • Budget tier: prototype, low-volume, production

Output Format

project-spec.md Structure

# Project Specification: [Name]

## Overview
[Brief description and goals]

## Requirements Summary
| Category | Requirement |
|----------|-------------|
| Power Input | ... |
| Voltage Rails | ... |
| MCU | ... |
| Connectivity | ... |

## Detailed Requirements
[Sections for each category with full details]

## Constraints
[Physical, environmental, budget constraints]

## Open Questions
[Any unresolved items]

design-constraints.json Schema

See reference/​CONSTRAINT-SCHEMA.md for full schema documentation.

Guidelines

  • Ask clarifying questions rather than assuming
  • Suggest common solutions when user is unsure
  • Flag potential issues early (power budget, space constraints)
  • Keep the spec focused - avoid scope creep
  • Document rationale for key decisions
  • Use project templates from reference/​PROJECT-TEMPLATES.md as starting points

Architecture Validation Warnings

Before completing the architecture phase, check for these risky combinations:

ConditionWarning
2-layer + switching regulator"Consider 4-layer - switching regulators need solid ground plane"
2-layer + USB/​Ethernet"Controlled impedance difficult on 2-layer - consider 4-layer"
>2W total + no thermal plan"Add thermal budget - high power needs planning"
Hand assembly + fine-pitch (<0.5mm)"Verify solderability - fine-pitch is difficult to hand solder"
>0.5W component + no thermal strategy"Component dissipating >0.5W needs thermal attention"
Battery + LDO with high Vin-Vout"Consider buck converter for battery life"

When a warning condition is detected, present it to the user and ask if they want to:

  1. Update the design to address it
  2. Acknowledge the risk and proceed

Next Steps

After completing architecture, suggest:

  1. /​eda-source [component-role] to begin component selection
  2. Start with critical components: MCU, power regulators

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