qwen3-4b-instruct-2507-executorch-qnn-htp

Qwen3-4B-Instruct-2507 — ExecuTorch QNN/HTP artifacts

This repository contains the ExecuTorch export artifacts used for the mobile benchmark runs on Qualcomm Snapdragon HTP devices. The model is Qwen3-4B-Instruct-2507.

Model parameters

• Hidden/model dimension: 2560
• Hidden/FFN dimension: 9728
• Layers: 36
• Attention heads: 32
• Key/value heads: 8
• Head dimension: 128
• Vocabulary size: 151936
• RMSNorm epsilon: 1e-6
• RoPE theta: 5000000
• QK normalization: enabled
• HF RoPE: enabled
• Export mode: hybrid
• Prefill AR length: 128
• Maximum context length: 2048
• Decoding: greedy (temperature=0)

Hardware artifacts

• sm8650/hybrid_llama_qnn.pte: ExecuTorch QNN/HTP artifact for Qualcomm SM8650 (HTP v75-class devices).
• sm8750/qwen3_4b_hybrid_sm8750.pte: ExecuTorch QNN/HTP artifact for Qualcomm SM8750 (HTP v79-class devices).
• sm8650/qwen3-4b-meta.pth: consolidated Meta-format checkpoint used as the input to the SoC-specific export. It is not directly executable on a phone.

The PTE files are hardware-specific and should not be exchanged between SM8650 and SM8750 devices.

SoC mapping

• SM8650 = Qualcomm Snapdragon 8 Gen 3, Qualcomm Hexagon HTP v75 (the Redmi K70 Pro platform).
• SM8750 = Qualcomm Snapdragon 8 Elite, Qualcomm Hexagon HTP v79 (the Realme RMX5090 platform).

Checksums

• sm8650/qwen3-4b-meta.pth: 08eeaad348f70f17d2b6681b79f64f1c024dcc458e58b06c70722fc7dbde7ddd
• sm8650/hybrid_llama_qnn.pte: 5d85935429607e636cc87077be7397d88837bc568e8adfaeb0d970b0f0e29a2d
• sm8750/qwen3_4b_hybrid_sm8750.pte: 78a2d703aebdf15568240d6e11ac8434d83936ee86554ddff4abf6a945e2a331